Xiaomi is reportedly developing a flagship phone with built-in dynamic cooling fan technology. According to tipster DigitalChatStation, the company is actively testing the component. This move places Xiaomi in a growing race among smartphone makers to integrate active cooling systems. The goal is to prevent thermal throttling during intensive tasks like gaming, ensuring sustained peak performance.
Design and Placement of the Cooling System
The tipster suggests the cooling fan could be located within the camera bump, positioned behind the imaging modules. This innovative placement maximizes internal space while integrating advanced thermal management directly into the phone’s structure. The device is also expected to retain an IP68 dust and water resistance rating, indicating a sophisticated engineering challenge to incorporate the fan without compromising durability.
Potential Model: The Redmi K90 Ultra
While unconfirmed, speculation points to the Redmi K90 Ultra as the likely candidate. It may debut as Xiaomi’s first “FAN Edition” model. The phone is expected to carry a high-end chipset and feature an ultra-high refresh rate display. Externally, it may follow a minimalistic design similar to other K90 variants, with the internal cooling tech being its standout selling point.
The Competitive Landscape and Performance Benefits
Xiaomi is not alone in this pursuit. The tipster notes that Honor’s WIN Series currently leads in this niche. Additionally, the iQOO 15 Ultra is also rumored to feature an active cooling fan. This trend highlights a growing focus on sustained performance for mobile gaming and pro-grade applications.
How Active Cooling Enhances Experience
A built-in fan actively dissipates heat from the processor and battery. This prevents the performance drops (thermal throttling) common in powerful phones under heavy loads. Consequently, users can expect smoother gameplay, higher frame rates, and faster responsiveness. Moreover, better thermal management protects battery health and key components over the long term, contributing to both performance longevity and a smoother overall user experience.
Implications for the Smartphone Market
The integration of active cooling represents a shift from passive solutions (like vapor chambers) to more aggressive thermal management. It directly addresses a key pain point for power users and gamers. If successful, it could push thermal performance to the forefront of flagship specifications, alongside camera and display technology.
Heating Up the Performance Race
Xiaomi’s planned cooling fan phone signals its entry into an emerging high-performance segment. By tackling thermal constraints head-on, the company aims to deliver a device capable of uninterrupted elite performance. As the rumor mill churns, all eyes will be on the official unveiling to see how Xiaomi’s implementation stacks up against competitors. This move could redefine expectations for what a flagship smartphone can sustainably deliver, making thermal management a critical battleground in the years ahead.
